We are exhibiting this year on follwing fairs...
Detroit, Michigan, USA
April 4-5, 2017
June 1-2, 2017
September 27-28, 2017
April 4-6, 2017
June 20-22, 2017
Chicago, Illinois, USA
October 3-5, 2017
November 28-30, 2017
Find the optimal dimensions and the suitable cut fast, with lamination views and much additional information.
The answer to market demands: glulock HT
This further development of glulock®, an already proven bonding technology, offers a higher tensile strength and an increased sustainable temperature resistance at 180°C. Glulock HT can therefore be used permanently in high temperature environments.
Member of the association Forum ElektroMobilität e.V.
The KONGRESS of Forum ElektroMobilität e.V. brought together the drivers of innovation in the E-mobility industry and created a platfrom for an interchange to promote the common aim of all cooperation partners - the "success story of E-mobility". In this context Kienle + Spiess provides with its innovative product technologies and production processes an important input and is in close contact with companys from the key industries - mechanical engineering and automotive - as well as research institutes and the Federal Ministry of Education and Research.
More information about Forum ElektroMobiliät e.V.